首页> 外国专利> Thermal ductile, heat shrinkable multi layer film for the production of thermal formed heat shrinkable hollow packing, comprises carrier, adhesion mediator, oxygen-close barrier and seal layers

Thermal ductile, heat shrinkable multi layer film for the production of thermal formed heat shrinkable hollow packing, comprises carrier, adhesion mediator, oxygen-close barrier and seal layers

机译:用于生产热成型热收缩空心填料的热延展性,热收缩多层薄膜,包括载体,粘合介质,氧气密闭阻隔层和密封层

摘要

The mediator layer has a thickness of 20 mu m and is based on ethyl vinyl acetate copolymer having vinyl acetate content of 3-18 mol%. The carrier layer has a thickness of 5-100 mu m and is based on polyethylene, ethyl copolymer, polypropylene and propylene copolymer. The seal layer has a thickness of 5-25 mu m and is based on polyolefins, olefin copolymers, polyalkylmethacrylate and/or alkylmethacrylate copolymers. A heat shrinkage has a stretching ratio of 1:5-1:3. The adjacent layer has a thickness of 50-250 mu m. The barrier layer has a thickness of 5-50 mu m and is based on polyvinylidene chloride copolymer and ethyl/vinylalkohol copolymer. Independent claims are included for: (1) a method of producing a thermal formed heat shrinkable hollow packing; (2) the production of a packing; (3) a packing machine; (4) the production of a packing using heat shrinkable multilayer film; and (5) sealing an upper foil on a hollow packing.
机译:介体层的厚度为20μm,并且基于乙酸乙烯酯含量为3-18mol%的乙基乙酸乙烯酯共聚物。载体层的厚度为5-100μm,并且基于聚乙烯,乙基共聚物,聚丙烯和丙烯共聚物。密封层的厚度为5-25μm,并且基于聚烯烃,烯烃共聚物,聚甲基丙烯酸烷基酯和/或甲基丙烯酸烷基酯共聚物。热收缩的拉伸比为1:5-1:3。相邻层的厚度为50-250μm。阻挡层具有5-50μm的厚度,并且基于聚偏二氯乙烯共聚物和乙基/乙烯基醇共聚物。包括以下独立权利要求:(1)一种生产热成型的热收缩中空填料的方法; (二)包装的生产; (三)包装机; (4)使用热收缩性多层膜生产填料; (5)将上部箔密封在中空包装上。

著录项

  • 公开/公告号DE102005017937A1

    专利类型

  • 公开/公告日2006-10-19

    原文格式PDF

  • 申请/专利权人 CFS KEMPTEN GMBH;

    申请/专利号DE20051017937

  • 申请日2005-04-18

  • 分类号B65D65/40;B65B9/04;B65B51/10;B65B53/02;B29C51/08;B32B27/08;B32B7/00;B32B7/06;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:18

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