Microelectronic arrangement manufacture involves arranging components of microelectronic arrangement in assembly position, connecting components using bonding wires and setting components to final position deforming bonding wires

摘要

The method involves electrically connecting the components (10,60) of a microelectronic arrangement using bonding wires (170). The components are first arranged in assembly position, and then the bonding wires are connected to the components in assembly position. The components are then set to their given final position, deforming the bonding wires connecting them. The components are soldered in the their final position.