Sn - ag - cu solder and its application to the surface to surface treatment and fitting of components

摘要

PROBLEM TO BE SOLVED: To provide a solder than can inhibit copper corrosion cracks while keeping a characteristic of high wettability and methods for surface treatment for printed wiring boards using the solder and for mounting electronic components on the surface of printed wire board using the solder. ;SOLUTION: The solder contains 1.0-4.0 wt.% of Ag, 0.4-1.3 wt.% of Cu, 0.02-0.06 wt.% of Ni, and 0.02-0.06 wt.% of Fe. The remainder consist of Sn and inevitable impurities.;COPYRIGHT: (C)2001,JPO