首页> 外国专利> Printed circuit board with lossy power distribution network for the reduction of the current feed plane - resonances

Printed circuit board with lossy power distribution network for the reduction of the current feed plane - resonances

机译:带有有损配电网络的印刷电路板,用于减小电流馈电平面-谐振

摘要

An interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board (10) includes a lossy power distribution network formed by a pair of parallel planar conductors (16, 18) separated by a dielectric layer (24). The pair of parallel planar conductors (16, 18) includes a first power supply plane (16) suitable for use, for example, as a ground plane and a second power supply plane (18) suitable for use, for example, as a power plane (e.g., VCC). The dielectric layer (24) has a loss tangent value of at least 0.2, and preferably of at least 0.3. In one embodiment, the dielectric material (24) between the power planes could have a frequency dependent loss tangent, such that a loss tangent value of 0.3 is achieved at and above the lowest resonance frequency of the planes. Due to the relatively large loss tangent characteristic of the dielectric layer (24) separating the power supply planes (16, 18), the electrical impedance characteristics associated with the power planes may be stabilized, and power plane resonances may be reduced. The printed circuit board (10) may also include one or more signal layers (14, 20) separated from the power planes (16, 18) by respective dielectric layers (22, 26). The dielectric layers (22, 26) separating the signal layers from the power planes or other signal layers may be associated with much lower loss tangent values, such as in the range of 0-0.05. In this manner, high frequency losses associated with the signal traces may be kept relatively low. In another embodiment, power plane resonances are suppressed by decreasing the thickness of the dielectric material (24) between the power supply planes (16, 18) to less than 0.5 mils. For example, in one embodiment, the plane separation is preferably reduced to less than 0.2 mils such as, for example, 0.1 mils. In embodiments where the plane separation approaches 0.1 mils or less, plane resonances may be substantially suppressed.
机译:一种采用有损配电网络来减少电源平面谐振的互连设备。在一个实施例中,印刷电路板(10)包括有损配电网,该有损配电网由被电介质层(24)隔开的一对平行的平面导体(16、18)形成。一对平行的平面导体(16、18)包括适合于例如用作接地平面的第一电源平面(16)和适合于例如用作电源的第二电源平面(18)。平面(例如,VCC)。介电层(24)的损耗角正切值至少为0.2,优选至少为0.3。在一个实施例中,功率平面之间的介电材料(24)可以具有与频率有关的损耗角正切,使得在损耗平面的最低谐振频率处或高于最低谐振频率时,损耗角正切值为0.3。由于分隔电源平面(16、18)的介电层(24)的相对较大的损耗角正切特性,与电源平面相关的电阻抗特性可以稳定,并且可以减小电源平面谐振。印刷电路板(10)还可包括一个或多个信号层(14、20),其通过各自的介电层(22、26)与电源平面(16、18)分开。将信号层与功率平面或其他信号层分开的电介质层(22、26)可以与低得多的损耗正切值相关联,例如在0-0.05的范围内。以这种方式,与信号迹线相关的高频损耗可以保持相对较低。在另一实施例中,通过将电源平面(16、18)之间的介电材料(24)的厚度减小到小于0.5密耳来抑制电源平面共振。例如,在一个实施例中,优选将平面间隔减小到小于0.2密耳,例如0.1密耳。在平面间隔接近0.1密耳或更小的实施例中,平面共振可以被基本抑制。

著录项

  • 公开/公告号DE60024128T2

    专利类型

  • 公开/公告日2006-06-29

    原文格式PDF

  • 申请/专利权人 SUN MICROSYSTEMS INC. SANTA CLARA CALIF. US;

    申请/专利号DE2000624128T

  • 发明设计人 NOVAK ISTVAN MAYNARD US;

    申请日2000-11-17

  • 分类号H05K1/16;H05K1/02;H05K9/00;

  • 国家 DE

  • 入库时间 2022-08-21 21:19:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号