Shaped bodies of resin for applications in electronic components

摘要

A resin molded component, comprising metal coating treatment being provided on the surface by a physical deposition method chosen from among sputtering, vacuum deposition, and ion plating after the surface is activated by plasma treatment, and is produced by forming a resin composition combined a base resin comprising of a thermoplastic resin or a thermosetting resin with a rubber-like elastic material.