Support for a semiconductor laser diode, a method in order to produce the subcarriers, and semiconductor laser diode with the carrier

摘要

PURPOSE: A submount of a semiconductor laser diode, its fabrication method and a semiconductor laser diode assembly adopting the same are provided, which have a solder layer having an equal thickness and chemical composition. CONSTITUTION: According to the submount(200) of a semiconductor laser diode flip-chip-bonded to a semiconductor laser diode chip(100) comprising the first electrode(180) and the second electrode(170), a substrate(110) has the first and the second step surface having a corresponding height difference corresponding to a step difference between the first and the second electrode. The first and the second metal layer are formed with the same thickness as the first step surface and the second step surface. And the first and the second solder layer are formed with the same thickness as the first and the second metal layer and are bonded to the first and the second electrode respectively.