A COMPOSITION CONTAINS A NETWORKABLE MATRIX PERCURSOR AND A PORE STRUCTURE FORMING MATERIAL AND A POROUS MATRIX MANUFACTURED THEREFROM

摘要

A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.