Unit e.g. microprocessor, cooling process, involves introducing determined volumes of liquid and its vapor into airtight enclosure, and circulating increased air flow in spaces separating hollow plates of thermal exchanger

摘要

The process involves introducing determined volumes of liquid and its vapor into an airtight enclosure. An assembly is installed in an apparatus such that it is oriented relative to the vertical to form a circulation by thermosiphon. The installation allows a hollow thermal block to correctly couple with a thermal plate of a unit to be cooled. Increased air flow is circulated in spaces separating hollow plates of a thermal exchanger. The assembly includes the thermal exchanger with an active TET unit, the hollow thermal block and the thermal plate of the unit to be cooled. An independent claim is also included for a cooling device.