Process to increase thermal conductivity of microencapsulated phase change material, used to carry out heat exchange between heat transfer liquid and enclosure, comprises metalization of the external surface of microencapsulated material

摘要

Process to increase the thermal conductivity of a microencapsulated phase change material (PCM) (A) (formed of a polymeric microcapsule (having diameter 50nm-50mu m) containing a phase changing material) comprises metalization of the part of the external surface of the microcapsule of (A) by depositing on the surface of a heat conducting material (having thickness lower than 500 nm). Independent claims are also included for: (1) microencapsulated phase change material (PCM); and (2) enclosure (having a heat conducting wall) comprising (A), where the enclosure is a compartment or a packing and/or (A), which are in the form of powder.