首页> 外国专利> LASER BEAM MACHINING APPARATUS, LASER BEAM OPTICAL SYSTEM,LASER BEAM MACHING METHOD, AND METHOD FOR REPAIRING DEFECT OF ACTIVE MATRIX SUBSTRATE

LASER BEAM MACHINING APPARATUS, LASER BEAM OPTICAL SYSTEM,LASER BEAM MACHING METHOD, AND METHOD FOR REPAIRING DEFECT OF ACTIVE MATRIX SUBSTRATE

机译:激光束加工设备,激光束光学系统,激光束加工方法以及活性基质基质的缺陷修复方法

摘要

PPROBLEM TO BE SOLVED: To mitigate the non-uniformity of the intensity distribution by the interference pattern of laser beams. PSOLUTION: A laser beam machining apparatus comprises a pulse laser beam oscillator 1, a slit 40 for limiting the laser beam flux, an illumination optical system 30 for uniformly illuminate the slit and a phase shift part 20, and an imaging lens 5 for performing the reduced projection of the laser beams passed through the slit 40 on an object 6 for machining. The laser beam flux is partitioned by the phase shift part 20 to shift the phase in a superposing manner on the slit 40, and uniform machining without any interference pattern is performed by suppressing the interference of the unified laser beam flux. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:通过激光束的干涉图来减轻强度分布的不均匀性。解决方案:激光加工设备包括脉冲激光束振荡器1,用于限制激光束通量的狭缝40,用于均匀地照射狭缝的照明光学系统30和相移部20以及成像透镜5。用于减小穿过狭缝40的激光束在加工对象6上的投射。激光束通量被相移部20划分,以在狭缝40上叠加地相移,并且通过抑制统一的激光束通量的干涉来执行没有任何干涉图案的均匀加工。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007260694A

    专利类型

  • 公开/公告日2007-10-11

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP20060085827

  • 发明设计人 TAKADA MASAHIRO;

    申请日2006-03-27

  • 分类号B23K26/073;B23K26/06;B23K26/067;B23K26;H01S3/10;B23K101/40;

  • 国家 JP

  • 入库时间 2022-08-21 21:16:25

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