COPPER BALL FOR ANODE FOR COPPER PLATING, PLATING APPARATUS, COPPER PLATING METHOD AND METHOD OF MANUFACTURING PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To improve plating characteristics such as uniformity of electrodeposition by suppressing the peeling-off of a black film formed on the surface of a copper ball of an anode for copper plating.;SOLUTION: The copper ball for the anode is used as the anode for copper plating and comprises crystal grains of copper containing phosphorus element, wherein ≥70% of the number of the crystal grains in total crystal grains constituting the copper ball for the anode has ≥10 μm minor axis and ≥60% of the number of the crystal grains in total crystal grains constituting the copper ball for the anode has ≥30 mμ major axis.;COPYRIGHT: (C)2008,JPO&INPIT