STOPGAP METHOD OF MINIMUM VIA

摘要

PROBLEM TO BE SOLVED: To provide a stopgap method of a minimum via which makes it possible to satisfactorily carry out a stopgap of the minimum via when a via of a printed circuit board is filled with stopgap resin.;SOLUTION: When carrying out a stopgap formation of resin into the via of the printed circuit board, there are provided: a step of punching insulating resin for the printed circuit board by a laser beam; a step of carrying out a stopgap of the via by vaporizing or melting and dispersing the stopgap resin by the laser beam; a step of drying and curing the stopgap resin; and a process of eliminating surplus stopgap resin from the via.;COPYRIGHT: (C)2008,JPO&INPIT