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TINNING COAT, TINNING LIQUID FOR FORMING TINNING COAT, METHOD FOR FORMING TINNING COAT AND CHIP TYPE ELECTRONIC PARTS FORMED OF ELECTRODE WITH TINNING COAT
TINNING COAT, TINNING LIQUID FOR FORMING TINNING COAT, METHOD FOR FORMING TINNING COAT AND CHIP TYPE ELECTRONIC PARTS FORMED OF ELECTRODE WITH TINNING COAT
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机译:镀锡皮,镀锡皮的镀锡液,镀锡皮的方法以及用镀锡皮制成的带电极的芯片型电子零件
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摘要
PROBLEM TO BE SOLVED: To provide a technique capable of forming a tinning coat which generates no whisker under severe thermal shock test conditions and is not affected by substrate metal.;SOLUTION: The tinning coat provided by electrolyzing a tinning liquid includes a compression stress and has such an anti-whisker characteristic that the compression stress measured by the spiral method is at least 1 MPa. Further upon the formation of the tinning coat, tin methanesulfonate is used as a supply source and the tinning liquid or the like which contains sodium sulfate as a conductive salt and an amphoteric surface active agent is used.;COPYRIGHT: (C)2007,JPO&INPIT
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