首页> 外国专利> TINNING COAT, TINNING LIQUID FOR FORMING TINNING COAT, METHOD FOR FORMING TINNING COAT AND CHIP TYPE ELECTRONIC PARTS FORMED OF ELECTRODE WITH TINNING COAT

TINNING COAT, TINNING LIQUID FOR FORMING TINNING COAT, METHOD FOR FORMING TINNING COAT AND CHIP TYPE ELECTRONIC PARTS FORMED OF ELECTRODE WITH TINNING COAT

机译:镀锡皮,镀锡皮的镀锡液,镀锡皮的方法以及用镀锡皮制成的带电极的芯片型电子零件

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of forming a tinning coat which generates no whisker under severe thermal shock test conditions and is not affected by substrate metal.;SOLUTION: The tinning coat provided by electrolyzing a tinning liquid includes a compression stress and has such an anti-whisker characteristic that the compression stress measured by the spiral method is at least 1 MPa. Further upon the formation of the tinning coat, tin methanesulfonate is used as a supply source and the tinning liquid or the like which contains sodium sulfate as a conductive salt and an amphoteric surface active agent is used.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种能够形成镀锡涂层的技术,该镀锡涂层在严酷的热冲击测试条件下不会产生晶须,并且不受基材金属的影响。;解决方案:通过电解镀锡液提供的镀锡涂层包括压应力和具有这样的抗晶须特性,即通过螺旋法测得的压缩应力为至少1MPa。此外,在形成镀锡层时,使用甲磺酸锡作为供给源,并使用含有硫酸钠作为导电盐和两性表面活性剂的镀锡液等。版权所有:(C)2007,JPO&INPIT

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