DRY TYPE ULTRASONIC FLAW DETECTION METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dry type ultrasonic flaw detection method capable of inspecting an inspected object even when the inspected object is an inspected substrate of high mounting efficiency or the inspected range is large.;SOLUTION: The whole of a wiring board 4 is covered with liquid resin, and the resin is hardened, thereby forming a resin layer 1. The wiring board 4 covered with the resin layer 1 is put into an ultrasonic wave transmission medium 2 stored in a medium storage vessel 3, and ultrasonic wave is emitted to a semiconductor chip 5 via the resin layer 1 from an ultrasonic wave probe 8 to inspect a flaw.;COPYRIGHT: (C)2007,JPO&INPIT