首页> 外国专利> SURFACE-COATED CERMET CUTTING THROW-AWAY TIP HAVING HARD COATING LAYER EXHIBITING EXCELLENT CHIPPING RESISTANCE IN HIGH SPEED CUTTING OF HIGH HARDNESS STEEL

SURFACE-COATED CERMET CUTTING THROW-AWAY TIP HAVING HARD COATING LAYER EXHIBITING EXCELLENT CHIPPING RESISTANCE IN HIGH SPEED CUTTING OF HIGH HARDNESS STEEL

机译:高速切削高硬度钢时,具有硬涂层的表面涂层金属陶瓷切削刀头具有出色的抗切削性

摘要

PROBLEM TO BE SOLVED: To provide a coated cutting tip having a hard coating layer exhibiting excellent chipping resistance in high speed cutting of high hardness steel.;SOLUTION: One layer of the hard coating layers of the coated cutting tip is constituted of a reformed TiCN layer showing a constituent atom sharing lattice point distribution graph in which a maximum peak exists in Σ3 and a distribution rate occupied in the whole of the Σ3 is ≥60% in a constituent atom sharing lattice point distribution graph prepared based on a measured inclined angle obtained by irradiating each of crystal grains existing in a measuring range of a surface polishing surface with an electron beam by using a field emission scanning electronic microscope and measuring an inclined angle made by normals of a (001) surface and a (011) surface to be crystal faces of the crystal grains in relation to a normal of the surface polishing surface. The surface of the Al2O3 layer is polished to have the surface roughness Ra: ≤0.2μm, and a hard coating layer residual stress reduction pattern is formed by laser beam irradiation on the polishing surface.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种具有硬涂层的涂层切削刀片,该涂层具有在高硬度钢的高速切削中表现出​​优异的抗崩裂性。解决方案:涂层切削刀片的一层硬涂层由改性的TiCN构成层示出了组成原子共享晶格点分布图,其中最大峰存在于Σ 3中,并且在整个σ3中占据的分布率在根据以下方法制备的组成原子共享晶格点分布图中为≥ 60%。通过使用场发射扫描电子显微镜用电子束照射存在于表面抛光表面测量范围内的每个晶粒并测量由(001)表面和( 011)表面是相对于表面抛光表面的法线的晶粒的晶面。抛光Al 2 O 3 层的表面以具有Ra:≤0.2μm的表面粗糙度,并形成硬涂层残余应力降低图案。激光束在抛光面上的照射。;版权所有:(C)2007,日本特许厅

著录项

  • 公开/公告号JP2007216348A

    专利类型

  • 公开/公告日2007-08-30

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20060041147

  • 发明设计人 OSADA AKIRA;NAKAMURA KEIJI;HONMA HISASHI;

    申请日2006-02-17

  • 分类号B23B27/14;B24C1/02;B24C11/00;C23C16/30;

  • 国家 JP

  • 入库时间 2022-08-21 21:14:28

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