EPOXY RESIN MOLDING COMPOUND FOR SEALING ELECTRIC COMPONENT AND ELECTRIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability and reliability, and effectively suppressing oxide film exfoliation of a copper-based lead frame, and to provide an epoxy resin molding compound for sealing electric components.;SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a silane coupling agent and (D) an inorganic filler as essential ingredients, wherein silane coupling agent of the ingredient (C) is represented by general formula (I) (wherein, R¹ is H, a 1-6C alkyl or a 1-2C alkoxy; R² is a 1-6C alkyl or phenyl; R³ is methyl or ethyl; and n is 1-6), and the epoxy resin molding compound for sealing electric components comprises the resin composition.;COPYRIGHT: (C)2007,JPO&INPIT