Electrical and electronic parts low pressure insert molding resin composition, method of manufacturing the electrical and electronic component sealing body and the electrical and electronic component sealing body

摘要

Provided is a resin composition for a sealing body for electric and electronic components. The resin composition has good adhesion with electric and electronic substrates having crosslinked polyethylene-covered wires, and the like, and has excellent durability against environmental loads such as cold-hot cycle loads and high-temperature, high-humidity loads. Also provided is a method for producing the sealing body for electric and electronic components. A resin composition for low-pressure insert molding of electric and electronic components, said resin composition containing, per 100 mass% of the resin composition, 50 mass% or more of a polyolefin, 5 to 30 mass% of an acid-modified polyolefin, and 10 to 45 mass% of a crystalline copolyester, and having a melt flow rate (MFR) of 60 g/10 minutes or greater as determined at 190ºC under a load of 2,160 g.