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electrical and electronic component sealing resin composition, method of manufacturing the electrical and electronic component sealing body and the electrical and electronic components sealing body

机译:电气电子部件密封树脂组合物,电气电子部件密封体的制造方法以及电气电子部件密封体

摘要

filling property and sealants of the practical level of sealant and the electrical and electronic components to provide an electrical electronic component sealing resin composition capable of providing a no bleed-out of the flame retardant while maintaining the adhesiveness flame retardant electrical electronic component sealing member. Copolyester elastomer (X), brominated epoxy resin (B1), and contain non-brominated epoxy resin (B2) and the polyolefin resin (C), and dried below water content of 0.1% was heated to 220 imparts pressure 1MPa, hole diameter 1.0mm, the melt viscosity when it is extruded from a die with a thickness of 10mm or less 5dPa s or more 3000dPa s, electric and electronic parts encapsulating resin composition, electric and electronic using the same method of manufacturing a part sealing body and electrical and electronic components sealing body.
机译:具有实用水平的密封剂和电气电子部件的填充性能和密封剂,从而提供了一种电气电子部件密封树脂组合物,该组合物能够在保持阻燃性的电气电子部件密封部件的粘合性的同时不泄漏阻燃剂。将共聚酯弹性体(X),溴化环氧树脂(B1)和含有非溴化环氧树脂(B2)和聚烯烃树脂(C)干燥,并在水含量低于0.1%的条件下加热至220,施加压力1MPa,孔直径1.0 mm,从厚度小于或等于10mm的模具中挤出5dPa s或大于3000dPa s时的熔体粘度,封装树脂组合物的电气和电子部件,使用与制造部件密封体相同的方法制造的电气和电子产品,以及电子元件密封体。

著录项

  • 公开/公告号JPWO2013031593A1

    专利类型

  • 公开/公告日2015-03-23

    原文格式PDF

  • 申请/专利权人 東洋紡株式会社;

    申请/专利号JP20130531228

  • 发明设计人 舩岡 大樹;志賀 健治;

    申请日2012-08-22

  • 分类号C08L67;C08L63;C08L23;C08L61/04;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:22

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