WIRING STRUCTURE, DEVICE, PROCESS FOR MANUFACTURING DEVICE, LIQUID DROP EJECTION HEAD, PROCESS FOR MANUFACTURING LIQUID DROP EJECTION HEAD, AND LIQUID DROP EJECTOR

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable wiring structure in which a driver IC and a drive element having a level difference can be conducted without causing disconnection, and to provide a device and its manufacturing process, a liquid drop ejection head and its manufacturing process, and a liquid drop ejector.;SOLUTION: In the wiring structure, a second member 20 is provided on a first member 10, and wiring 34 is routed from the upper surface of the second member 20 to the upper surface of the first member 10 through the side face of the second member 20. A first conductive portion 90 is provided on the upper surface of the first member 10, a second conductive portion 44 is provided on the second member 20, an insulating member is provided from the side face of the second member 20 to the upper surface of the first member 10 while covering between the first member 10 and the second member 20, and the wiring 34 passes on the insulating member to connect between the second conductive portion 44 and a first conductive portion 90.;COPYRIGHT: (C)2007,JPO&INPIT