THREE-DIMENSIONAL WIRING AND ITS MANUFACTURING METHOD, AND DYNAMIC QUANTITY SENSOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional wiring with a large S/N ratio and a dynamic quantity sensor using the three-dimensional wiring, by preventing loss of an electrical signal due to a resistor of a feed-through and generation of noise due to heat and incidence of electromagnetic wave such as light.;SOLUTION: The three-dimensional wiring comprises a first insulating substrate 200 which is made of an insulating material and has a through-hole; a second insulating substrate 300 made of an insulating material; a frame 101 which is made of a semiconductor substrate 100 and sandwiched between the first insulating substrate and the second insulating substrate; a feed-through 50 which is made of a conductive material, sandwiched between the first insulating substrate and the second insulating substrate while facing the through-hole; a lower electrode 301 which is made of a conductive material and provided on the second insulating substrate to be electrically connected to the feed-through; and an external electrode 205 which is made of a conductive material and covers at least an inner peripheral surface of the through-hole to be electrically connected to the feed-through.;COPYRIGHT: (C)2007,JPO&INPIT