首页> 外国专利> WAFER-TYPE TEMPERATURE SENSOR, TEMPERATURE MEASURING APPARATUS USING THE SAME, HEAT TREATMENT APPARATUS HAVING TEMPERATURE-MEASURING FUNCTION, AND TEMPERATURE-MEASURING METHOD

WAFER-TYPE TEMPERATURE SENSOR, TEMPERATURE MEASURING APPARATUS USING THE SAME, HEAT TREATMENT APPARATUS HAVING TEMPERATURE-MEASURING FUNCTION, AND TEMPERATURE-MEASURING METHOD

机译:晶片型温度传感器,使用其的温度测量装置,具有温度测量功能的热处理装置和温度测量方法

摘要

PPROBLEM TO BE SOLVED: To provide a wafer-type temperature sensor capable of eliminating the need for A/D converter, adapted to automation, enhancing resistance to heat, and measuring the temperature distribution of a wafer. PSOLUTION: The wafer-type temperature sensor 10 is provided with the wafer 1 and a plurality of temperature sensors 2a, 2b, ..., each being with the upper surface of the wafer 1 partitioned into a plurality of regions. The temperature sensors 2a, 2b, ... are each provided with an oscillation circuit for generating frequency signals, based on the temperature of a corresponding region within a frequency band that is different region by region, in response to the input of the supply voltage. PCOPYRIGHT: (C)2007,JPO&INPIT
机译:

要解决的问题:提供一种晶片型温度传感器,该传感器能够消除对A / D转换器的需求,适用于自动化,增强耐热性并测量晶片的温度分布。

解决方案:晶片型温度传感器10设置有晶片1和多个温度传感器2a,2b,...,每个温度传感器将晶片1的上表面划分为多个区域。温度传感器2a,2b,...分别设置有振荡电路,该振荡电路根据电源电压的输入,基于区域不同的频带内的对应区域的温度,生成频率信号。 。

版权:(C)2007,日本特许厅&INPIT

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