AU-SN ALLOY BUMP WITHOUT INCORPORATING LARGE VOID AND METHOD FOR MANUFACTURING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a bump made of an Au-Sn alloy without incorporating large voids and a manufacturing method of the bump. PSOLUTION: This bump made of the Au-Sn alloy without incorporating the large voids has composition composed of, by mass, 20.5-23.5% Sn, the balance Au with inevitable impurities and has structure in which Sn-rich primary crystal phase of 0.5-30 area% is crystallized in a ground material. PCOPYRIGHT: (C)2007,JPO&INPIT