Device and the method for electrification test

摘要

The device for IC package test, temperature sensor 48, the heater (or the cooler) has unified 44 and control control equipment 42 in one modular unit 22 and 72. This control control equipment 42, in modular unit is installed 22 and 72, in temperature sensor it is the microprocessor which is connected 48 and heater 44. This control control equipment 42 makes that the temperature which is in the midst of the test which is appointed through the communications network 71 where the user is connected to control control equipment 42, is input possible. The temperature which is in the midst of the test of each IC package 54 is controlled by control control equipment 42, has become separate temperature. Installation and you can remove this module 22, simply by using the latch 26 of the socket for test, vis-a-vis open top socket 20. When plural sensors 48, the heater (or the cooler) the matrix of 44 and control control equipment 42 in one top attachment plate 72 sensor 48 and the heater (or the cooler) separately it is arranged when spring energization it is done, to be fast installation and you can remove plural IC packages 54 quickly from there vis-a-vis the socket 20 for plural tests. Temperature sensor 48 includes the heat insulation material 138 which covers the sensor and this sensor housing 134 which are arranged inside thermal conductivity sensor housing 134. Selective figure Figure 3