首页> 外国专利> CUTTING TOOL OF SURFACE-COATED CERMET WITH HARD COATING LAYER ACHIEVING EXCELLENT ANTI-CHIPPING PERFORMANCE IN HIGH-SPEED CUTTING WORK TO HARD-TO-CUT MATERIAL

CUTTING TOOL OF SURFACE-COATED CERMET WITH HARD COATING LAYER ACHIEVING EXCELLENT ANTI-CHIPPING PERFORMANCE IN HIGH-SPEED CUTTING WORK TO HARD-TO-CUT MATERIAL

机译:具有硬涂层的表面涂层金属陶瓷切削刀具在硬质材料的高速切削工作中具有出色的抗切削性能

摘要

PROBLEM TO BE SOLVED: To provide a cutting tool of surface-coated cermet, comprising a hard coating layer achieving excellent anti-chipping performance in high-speed cutting work to hard-to-cut material.;SOLUTION: This cutting tool of surface-coated cermet comprises the hard-coating layer, of which surface layer is composed of a reformed (Cr, Zr)2O3 layer, with part of Cr substituted with Zr. Using a field emission type scan electron microscope, an electron beam is radiated to each crystal grain comprising a hexagonal crystal lattice existing in a measurement range of a surface polished surface to measure an inclination angle formed by the normal lines of face (0001) and face (10-10) as crystal faces of the crystal grain. In a component atom shared lattice point distribution graph, produced on the basis of measurement inclination angles obtained as results, the highest peak exists at Σ3, and the distribution ratio of Σ3 in ΣN+1 is 60% or more.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种表面涂层金属陶瓷的切削工具,该切削工具包括一个硬涂层,在高速切削工作中对难以切削的材料具有出色的抗崩落性能。涂覆的金属陶瓷包括硬涂层,其表面层由重整(Cr,Zr) 2 O 3 层组成,部分Cr被Z​​r取代。使用场发射型扫描电子显微镜,向包括在表面抛光表面的测量范围内的六方晶格的每个晶粒发射电子束,以测量由面(0001)和面的法线形成的倾斜角。 (10-10)作为晶粒的晶面。在根据结果获得的测量倾斜角而生成的成分原子共享晶格点分布图中,最高峰存在于Σ 3处,并且Σ 3在Σ N + 1中的分布比率为60%或更高。 。;版权:(C)2007,日本特许厅和INPIT

著录项

  • 公开/公告号JP2007111785A

    专利类型

  • 公开/公告日2007-05-10

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20050303071

  • 发明设计人 OSADA AKIRA;NAKAMURA KEIJI;HONMA HISASHI;

    申请日2005-10-18

  • 分类号B23B27/14;C23C16/30;C23C16/40;

  • 国家 JP

  • 入库时间 2022-08-21 21:11:05

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