Flip chip implemental manner and flip chip implemental structure

摘要

P To improve the reliability of electrical connection when used in a wide temperature range. PSOLUTION: (A) A resin layer 216 having the coefficient of thermal expansion greater than a bump 222 is formed in at least a fixed region of a flip chip 220 of a printed circuit board 200 excepting a conductor propellent-actuated device 218. (B) A thermosetting non-conductive adhesive 224 is supplied to a flip chip mounting position of the printed circuit board. (C) The bump 222 of the flip chip 220 is aligned with the conductor propellent-actuated device 218 of the printed circuit board 200, to thereby hold the flip chip 220 by pressing it to the print circuit board 200 with a prescribed pressure. (D) The printed circuit board 200 is heated and the thermosetting non-conductive adhesive 224 is hardened. (E) The printed circuit board 200 is cooled. (F) Pressing force of the flip chip 220 is removed. PCOPYRIGHT: (C)2005 and JPO& NCIPI