Solder printing inspection processing method and solder printer

摘要

PROBLEM TO BE SOLVED: To provide a solder print inspection treatment method which can check a bad mark without the need for an expensive installation of high precision in a position inspection process. SOLUTION: Solder is printed on a board, and at the same time, solder is printed on a bad mark. When the board on which solder is printed is inspected to be imperfect the bad mark is made effectively by eliminating the solder. As a result, made possible discrimination of an imperfect board is facilitated and made possible by using only a printer. Since position precision of the bad mark is high, imperfect board detection in the later process is possible with high precision.