MASK SUBSTRATE, AND LASER BEAM DICING DEVICE AND METHOD

摘要

PPROBLEM TO BE SOLVED: To deter irradiation of a laser beam to a region other than the prescribed region of an object of laser beam machining and also to surely reform the prescribed region of the object of laser beam machining. PSOLUTION: A mask substrate M has a prescribed opening part M1 where the laser beam to be condensed can be passed through. The width of a laser beam emitting port M2 of the opening part M1 is relatively narrow and the width of the leaser beam incident port M3 of the opening part M1 is relatively wide. PCOPYRIGHT: (C)2007,JPO&INPIT