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LASER DICING DEVICE, METHOD OF LASER BEAM MODULATION, AND METHOD OF DICING A SUBSTRATE
LASER DICING DEVICE, METHOD OF LASER BEAM MODULATION, AND METHOD OF DICING A SUBSTRATE
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机译:激光划片装置,激光束调制方法以及对基体进行划片的方法
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摘要
A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
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