首页> 外国专利> Production manner of the indium metal particulate, includes the indium metal particulate the coating liquid for transparent conductive coating formation which, distributed sol, the transparent conductive coating attaching backing material,

Production manner of the indium metal particulate, includes the indium metal particulate the coating liquid for transparent conductive coating formation which, distributed sol, the transparent conductive coating attaching backing material,

机译:铟金属微粒的生产方式,包括铟金属微粒,用于形成透明导电涂层的涂布液,分散溶胶,透明导电涂层附着的背衬材料,

摘要

PROBLEM TO BE SOLVED: To provide indium based metal fine particles and a dispersion sol appropriately usable for forming a transparent and conductive film having an excellent antistatic property and electromagnetic shielding property and also having an excellent manufacturing reliability and cost effectiveness. ;SOLUTION: The indium based metal fine particles have a 2-200 nm average particle size. The indium based metal fine particles contain indium metal only or one or more kinds of metal components selected from among Sb, Sn, Ag, Au, Zn, Cu, Bi and Cd together with the indium metal. The indium based metal fine particles dispersion sol is obtained by dispersing the indium based metal fine particles in water and/or an organic solvent. In a method for manufacturing the indium based metal fine particles, a reducing agent is added to a mixed alcohol solution containing an indium compound and an organic stabilizing agent and having a ≥40 wt.% alcohol content in the solvent.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供适合用于形成透明导电膜的铟基金属细颗粒和分散溶胶,所述透明导电膜具有优异的抗静电性能和电磁屏蔽性能,并且还具有优异的制造可靠性和成本效益。 ;解决方案:铟基金属细颗粒的平均粒径为2-200 nm。铟基金属细颗粒与铟金属一起仅包含铟金属或选自Sb,Sn,Ag,Au,Zn,Cu,Bi和Cd的一种或多种金属成分。铟系金属微粒分散溶胶通过将铟系金属微粒分散在水和/或有机溶剂中而得到。在制造铟基金属细颗粒的方法中,将还原剂添加到混合溶液中,该混合溶液包含铟化合物和有机稳定剂,并且在溶剂中的酒精含量为40%(重量)。 C)2004,日本特许厅

著录项

  • 公开/公告号JP4002469B2

    专利类型

  • 公开/公告日2007-10-31

    原文格式PDF

  • 申请/专利权人 触媒化成工業株式会社;

    申请/专利号JP20020146717

  • 申请日2002-05-21

  • 分类号B22F1/00;B22F9/24;C09C1/62;C09D1/00;C09D5/24;H01B1/22;H01B5/14;H01J29/88;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:16

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