Being the multilayer interconnection substrate where substrate structure and these use mannered null wiring which the multilayer interconnection substrate and

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of easily determining how laser processing is performed to a wiring provided on an inner layer, and its usage.;SOLUTION: In the multilayer wiring board 2 having a wiring 5 provided on an inner layer 4, the wiring 5 is provided with inspection-object portions 7 to be laser-processed, and an opening 8 for visual inspection that reaches the inspection-object portions 7 is formed on one surface opposite to the other surface on the side to which laser is irradiated. Besides the inspection-object portions 7 to be laser-processed, the wiring 5 is provided with terminals for inspection having one end thereof connected to the inspection-object portions 7. The other end of the terminal for inspection is derived to the board so as to be drawn outside.;COPYRIGHT: (C)2004,JPO