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SiGe (SGOI) substrate on insulator, Ge (GOI) substrate on insulator manufacturing method, semiconductor wafer, and semiconductor structure

机译:绝缘体上的SiGe(SGOI)衬底,绝缘体上的Ge(GOI)衬底的制造方法,半导体晶片和半导体结构

摘要

A method for fabricating germanium-on-insulator (GOI) substrate materials, the GOI substrate materials produced by the method and various structures that can include at least the GOI substrate materials of the present invention are provided. The GOI substrate material include at least a substrate, a buried insulator layer located atop the substrate, and a Ge-containing layer, preferably pure Ge, located atop the buried insulator layer. In the GOI substrate materials of the present invention, the Ge-containing layer may also be referred to as the GOI film. The GOI film is the layer of the inventive substrate material in which devices can be formed.
机译:提供了一种绝缘体上锗(GOI)衬底材料的制造方法,通过该方法制造的GOI衬底材料以及可以至少包括本发明的GOI衬底材料的各种结构。 GOI衬底材料至少包括衬底,位于衬底顶部的掩埋绝缘体层和位于掩埋绝缘体层顶部的含Ge层,优选为纯Ge。在本发明的GOI基板材料中,含Ge层也可以称为GOI膜。 GOI膜是可以在其中形成器件的本发明基底材料的层。

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