首页> 外国专利> The grinding device which uses the plane surface grinding jig and the said jig of the semiconductor chip and the work holder where the sample creation mannered null

The grinding device which uses the plane surface grinding jig and the said jig of the semiconductor chip and the work holder where the sample creation mannered null

机译:使用半导体芯片的平面磨削夹具和上述夹具的磨削装置以及用于进行样品制作的工件夹具。

摘要

PROBLEM TO BE SOLVED: To provide a plane grinding fixture which uniformly expose a flat wiring layer as the analysis object in a semiconductor chip of multilayer structure, a plane grinding apparatus using the fixture, and a method of manufacturing sample for analysis of semiconductor chip.;SOLUTION: The plane grinding fixture 22 for the semiconductor chip 1 comprises a work holder 15 for fixing semiconductor chip 1, a gradient adjusting member 17 preformed behind the work holder 15 and adjusting gradient of the work holder 15, a cylindrical protection member 18 for covering the work holder 15 and the gradient adjusting member 17, and a sealing member 19 for sealing a gap between the work holder 15 and the protection member 18. A sample surface of the semiconductor chip 1 is exposed while projecting from an opening window 18a provided to the protection member 18.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种平面研磨夹具,该平面研磨夹具在多层结构的半导体芯片中均匀地暴露作为分析对象的平坦布线层,使用该夹具的平面研磨装置,以及用于分析半导体芯片的样品的制造方法。 ;解决方案:用于半导体芯片1的平面磨削夹具22包括:用于固定半导体芯片1的工件支架15;在工件支架15后面预成形的梯度调节部件17;以及用于调节工件支架15的梯度的部件;用于保护半导体芯片1的圆柱形保护部件18。覆盖工件支架15和梯度调节部件17的部件,以及用于密封工件支架15和保护部件18之间的间隙的密封部件19。半导体芯片1的样品表面从设置的开口窗18a突出并露出。授予保护成员18 .;版权:(C)2003,JPO

著录项

  • 公开/公告号JP3935352B2

    专利类型

  • 公开/公告日2007-06-20

    原文格式PDF

  • 申请/专利权人 シャープ株式会社;

    申请/专利号JP20010392339

  • 发明设计人 鶴原 健次;

    申请日2001-12-25

  • 分类号H01L21/304;B24B37/04;B24B7/22;B24B41/06;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 21:08:56

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