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The grinding device which uses the plane surface grinding jig and the said jig of the semiconductor chip and the work holder where the sample creation mannered null
The grinding device which uses the plane surface grinding jig and the said jig of the semiconductor chip and the work holder where the sample creation mannered null
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机译:使用半导体芯片的平面磨削夹具和上述夹具的磨削装置以及用于进行样品制作的工件夹具。
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摘要
PROBLEM TO BE SOLVED: To provide a plane grinding fixture which uniformly expose a flat wiring layer as the analysis object in a semiconductor chip of multilayer structure, a plane grinding apparatus using the fixture, and a method of manufacturing sample for analysis of semiconductor chip.;SOLUTION: The plane grinding fixture 22 for the semiconductor chip 1 comprises a work holder 15 for fixing semiconductor chip 1, a gradient adjusting member 17 preformed behind the work holder 15 and adjusting gradient of the work holder 15, a cylindrical protection member 18 for covering the work holder 15 and the gradient adjusting member 17, and a sealing member 19 for sealing a gap between the work holder 15 and the protection member 18. A sample surface of the semiconductor chip 1 is exposed while projecting from an opening window 18a provided to the protection member 18.;COPYRIGHT: (C)2003,JPO
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