ADHESIVE TAPE PEELING METHOD AND ADHESIVE TAPE PEELING DEVICE TO BE USED IN A WAFER TAPE MOUNTER

摘要

PROBLEM TO BE SOLVED: To provide a method that surely peels off an adhesive tape polymerized on a release tape and pastes it on the rear of a semiconductor wafer or ring frame.;SOLUTION: In this adhesive tape peeling method that pulls and moves a release tape b with a polymerized adhesive tape a via a sharp-angled bend route in the guide margin 56a of a peel-off plate 56, the above peel-off plate 56 is made a flat plate with an even thickness, and the crosswise central part of the above guide margin 56a is projected to a convex of the above bend of the release tape b to form an arc, viewed from a direction orthogonal to the plane of the above flat plate so that a pull can be applied. In addition, a tape press unit 57 is provided to make a polymerized point of the peel-off plate 56 and release tape b adjacent to the plane of the peel-off plate 56 in a direction orthogonal to the plane of the peel-off plate 56.;COPYRIGHT: (C)2007,JPO&INPIT