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Heat dissipation structure of the electrical junction box and the heat dissipation device and heat dissipation method thereof

机译:电接线盒的散热结构,散热装置及其散热方法

摘要

PPROBLEM TO BE SOLVED: To provide a heat radiating structure of an electrical junction box, a heat radiating device thereof, and a heat radiating method thereof, capable of restraining increase in the temperature of the electrical junction box assembled onto a reinforcement of a vehicle or the like. PSOLUTION: This electrical junction box comprises a reinforcement 63, a case 13 assembled onto the reinforcement 63, semiconductor switches 41SB3/SB, 42SB3/SB, 43SB3/SB, 44SB3/SBattached to the case 13. Radiating plates 41aSB3/SB, 42aSB3/SB, 43aSB3/SB, 44aSB3/SB, which release the heat generated at the bodies of the semiconductor switches 41SB3/SB, 42SB3/SB, 43SB3/SB, 44SB3/SB, are formed on the semiconductor switches 41SB3/SB, 42SB3/SB, 43SB3/SB, 44SB3/SBin a protruding manner, the semiconductor switches 41SB3/SB, 42SB3/SB, 43SB3/SB, 44SB3/SBare set adjacent to the reinforcement 63, and the fluid kept at a temperature lower than those of the semiconductor switches 41SB3/SB, 42SB3/SB, 43SB3/SB, 44SB3/SBis introduced into the reinforcement 63. Thus, the temperatures of the semiconductor switches can be maintained so as to be low. PCOPYRIGHT: (C)2003,JPO
机译:

要解决的问题:提供一种电接线盒的散热结构,其散热装置及其散热方法,其能够抑制组装到加强件上的电接线盒的温度升高。车辆等。

解决方案:该电接线盒包括加强件63,组装到加强件63上的壳体13,半导体开关41 3 ,42 3 ,43 3 ,44 3 连接到壳体13。散热板41a 3 ,42a 3 ,43a 3 ,44a 3 ,它们释放在半导体开关41 3 ,42 3 ,43 3 < / SB>,44 3 形成在半导体开关41 3 ,42 3 ,43 3 上,半导体开关41 3 ,42 3 ,43 3 ,44 3 设置在加强件63附近,并且流体的温度低于半导体开关41 3 ,42 3 ,43 <将SB> 3 ,44 3 引入到加强件63中。因此,可以将半导体开关的温度保持为较低。

版权:(C)2003,日本特许厅

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