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Cutting machine with a line light projection apparatus that line projection device

机译:具有线投光装置的线切割装置的切割机

摘要

PROBLEM TO BE SOLVED: To provide a line light projecting device capable of projecting a vivid line light to any object to be irradiated even if laser beams are cast in aslant and provide a cutting machine equipped with such a line light projecting device.;SOLUTION: The line light projecting device 10 is set in the condition that the axis 26 of a semiconductor laser 12 and the optical axis 24 of a focusing lens unit 14 are shifted appropriately. When the laser beam 32a passing the main point 31 of the lens unit 14 is focused at the point A, the laser beams 32b and 32c outside of the laser beam 32a are focused at point B located farther than A and point C located nearer than A, respectively. As a result, a vivid line light with all irradiating positions well focused can be obtained in the case the laser beams 32 are cast on the work to be cut from above aslant. Accordingly the line light projecting device 10 can be mounted to the cutting machine fitted with sawteeth 52 in a position which does not move together with the sawteeth 52 and where the laser beams are cast onto the work aslant.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种线光投射装置,即使激光束倾斜地投射,该线光投射装置也能够将生动的线光投射到要照射的任何物体上,并且提供一种配备有这种线光投射装置的切割机。线状光投射装置10被设定为半导体激光器12的轴26和聚焦透镜单元14的光轴24适当地偏移的条件。当通过透镜单元14的主要点31的激光束32a聚焦在点A时,激光束32a之外的激光束32b和32c聚焦在比A更远的点B和比A更近的点C。 , 分别。结果,在将激光束32从斜上方投影到待切割的工件上的情况下,可以获得具有良好聚焦的所有照射位置的生动的线光。相应地,线光投射装置10可以在不与锯齿52一起移动并且激光束被投射到工件斜面上的位置上安装到装配有锯齿52的切割机上。版权:(C)2004,日本特许厅

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