Loading and unloading method of thin plate-like object to be treated of loading and unloading equipment and thin plate-like object to be processed using this compound to the vertical heat treatment furnace

摘要

PROBLEM TO BE SOLVED: To provide a device for carrying in and out thin object to be treated in and out of vertical heat-treating furnace which is improved in throughput, can support an object to be treated in an excellent state, and can make the temperature distribution in the object uniform. ;SOLUTION: A device for carrying thin object to be treated in and out of vertical heat-treating furnace is provided with a carrier 1, a boat 2, and a semiconductor wafer transferring means 3. The means 3 is composed of semiconductor wafer placing fingers 8 and semiconductor wafer raising fingers 9 which are positioned below the fingers 8, and the fingers 8 and 9 are paired to each other so that the support rings 6 of the boat 2 can respectively get in between the fingers 8 and 9. Both fingers 8 and 9 can freely move in the horizontal direction. Each finger 9 has a semiconductor wafer raising member 13 which can be extended and contracted in the vertical direction. When the fingers 8 and 9 are respectively positioned above and below the support rings 6 of the boat 2, the raising members 13 do not interfere with the rings 6 and fingers 8. When the members 13 are extended in the above-mentioned state, the upper ends of the members 13 become higher than the fingers 8 and, when the members 13 are contracted, the upper ends become lower than the rings 6.;COPYRIGHT: (C)1998,JPO