Baseplate washing method, baseplate cleaning device and computer reading possible record medium

摘要

While in abbreviation horizontal attitude turning wafer W at specified rpm, supplying pure water to that surface with specified flow, after rinsing processing wafer W, it decreases the supply flow rate of pure water to wafer, W at the same time, it makes pure water supply point move from the center of wafer W to outside. In this way, while forming the liquid membrane outside abbreviating pure water supply point, spin it dries processes wafer W.