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PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN THE PLATING APPARATUS, AND PLATING METHOD
PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN THE PLATING APPARATUS, AND PLATING METHOD
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机译:用于该镀敷装置的镀敷装置,载体和铜溶解罐以及镀敷方法
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摘要
A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use; and an undiluted replacement liquid supplying section for supplying an undiluted replacement liquid as a source of the replacement liquid into the buffer container. Copper mesh members each prepared by weaving a copper wire, straight copper pipes or copper plates are accommodated as a copper source in each of the copper dissolution tanks. The copper dissolution tanks each include a detachable cartridge, in which the copper mesh members or the like are disposed.
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