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Dummy-fill-structure placement for improved device feature location and access for integrated circuit failure analysis
Dummy-fill-structure placement for improved device feature location and access for integrated circuit failure analysis
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机译:虚拟填充结构放置可改善设备特征的位置和通路,以进行集成电路故障分析
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摘要
An integrated circuit comprising interconnects located in a layer on a semiconductor substrate. The circuit also comprises dummy-fill-structures located between the interconnects in the layer. The dummy-fill-structures form a plurality of fiducials, each of the fiducials being located in a different region of the layer. Each fiducial comprises a pre-defined recognition pattern that is different from every other fiducial in adjacent regions of the layer.
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