LED wafer-level chip scale packaging

摘要

A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die and its carrier substrate. The CSP structure is achieved by bonding pre-processed through-hole-filling carrier substrate against the flip-chip LED wafer.