Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same

摘要

A via array capacitor comprising: a capacitor body including a first main surface and a second main surface and having a structure in which dielectric layers and inner electrode layers are alternately laminated; a plurality of via conductors which conduct the inner electrode layers to each other and are, as a whole, arranged in array form; and metal-containing layers which are disposed on at least one of the first main surface and the second main surface, wherein a total of a thickness of the metal-containing layers disposed on the first main surface and a thickness of the metal-containing layers disposed on the second main surface is from 15% to 80% of an overall thickness of the via array capacitor.