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CMP CLEAN PROCESS FOR HIGH PERFORMANCE COPPER/LOW-K DEVICES
CMP CLEAN PROCESS FOR HIGH PERFORMANCE COPPER/LOW-K DEVICES
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机译:用于高性能铜/低k设备的CMP清洁工艺
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摘要
A post chemical-mechanical polishing cleaning method, comprising contacting a die with a first chemistry that removes at least some organic compounds and ions from a surface of the die. After contacting the die with the first chemistry, the method further comprises contacting the die with a second chemistry that removes at least some copper abutting the die surface. The method further comprises rinsing and drying the die.
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