首页> 外国专利> METHOD OF SIMULTANEOUSLY CONTROLLING ADI-AEI CD DIFFERENCES OF OPENINGS HAVING DIFFERENT SIZES AND ETCHING PROCESS UTILIZING THE SAME METHOD

METHOD OF SIMULTANEOUSLY CONTROLLING ADI-AEI CD DIFFERENCES OF OPENINGS HAVING DIFFERENT SIZES AND ETCHING PROCESS UTILIZING THE SAME METHOD

机译:同时控制具有不同尺寸和蚀刻过程的开口的ADI-AEI CD差异的方法

摘要

A method of simultaneously controlling the ADI-AEI CD differences of openings having different sizes is disclosed. The openings are formed by: forming an ARC and a photoresist layer with a first and a second opening patterns of different sizes therein on a material layer, and etching the ARC and the material layer with the photoresist layer as a mask to form in the material layer a first/second opening corresponding to the first/second opening pattern, wherein the etching recipe makes the first/second opening smaller than the first/second opening pattern by a first/second size difference (ΔS1/ΔS2) and the difference between ΔS1 and ΔS2 is a relative size difference. The method is characterized by that an etching parameter affecting the relative size difference is set at a first value in etching the ARC and at a second value different from the first value in etching the material layer.
机译:公开了一种同时控制具有不同尺寸的开口的ADI-AEI CD差异的方法。通过以下方式形成开口:在材料层上形成具有不同尺寸的第一和第二开口图案的ARC和光致抗蚀剂层,以及以光致抗蚀剂层作为掩模在材料中形成以蚀刻ARC和材料层。在第一/第二开口层上形成与第一/第二开口图案相对应的第一/第二开口,其中蚀刻配方使第一/第二开口比第一/第二开口图案小第一/第二尺寸差(ΔS 1 /ΔS 2 ),而ΔS 1 和ΔS 2 之间的差异是相对大小差异。该方法的特征在于,在蚀刻ARC时将影响相对尺寸差的蚀刻参数设置为第一值,并且在蚀刻材料层时将蚀刻参数设置为与第一值不同的第二值。

著录项

  • 公开/公告号US2007105322A1

    专利类型

  • 公开/公告日2007-05-10

    原文格式PDF

  • 申请/专利权人 PEI-YU CHOU;JIUNN-HSING LIAO;

    申请/专利号US20050163981

  • 发明设计人 PEI-YU CHOU;JIUNN-HSING LIAO;

    申请日2005-11-07

  • 分类号H01L21/8234;

  • 国家 US

  • 入库时间 2022-08-21 21:03:06

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