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A methodology for selecting process variables for feedback control with application to reactive ion etching

机译:一种选择过程变量进行反馈控制并应用于反应性离子刻蚀的方法

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摘要

In many semiconductor manufacturing processes, the important product characteristics cannot be measured in real-time and therefore cannot be directly controlled using real-time feedback control (RFC). However, the benefits of RFC, which include variation reduction through disturbance rejection, may be gained by feedback of process variables closely related to the product characteristics. Reduction of variation in product characteristics will boost process quality, improve yield and facilitate more aggressive product designs. Typically, selection of the process variables used for feedback is based upon qualitative knowledge about the process, which in many cases is limited.;A pair of methodologies has been developed for selecting the best process variables for feedback in order to minimize variation in the product characteristics. These methodologies utilize statistical analysis of data from designed experiments. Three factors contribute to variation in the product variables: the strength of the relationship between the potential feedback variables and the product characteristics, the effect process input adjustments have on the product variables, and sensor noise. The first methodology, Methodology 1, quantifies the first factor as the basis for feedback variable selection. The second methodology, Methodology 2, quantifies all three factors as the basis for feedback variable selection.;In Methodology 1, a set of designed experiments is executed while as many process variables as possible are recorded. The disturbance variables are included as factors in these experiments. Once the data are collected, different combinations of process variables are compared for their ability to predict the product characteristics. A subcategory of regression analysis called subset selection is applicable for this task. A new subset selection approach, labeled 'constraint-limited exhaustive search', is found for this purpose to perform superior to other techniques including principal component regression and partial least squares regression. The results of the subset selection are used as the basis upon which Methodology 1 recommends feedback variables. Methodology 2 uses Methodology 1 to generate a model of the process. This model is used to estimate the variation in the product characteristics for every possible combination of feedback variables. All three factors which contribute to variation are represented in these calculations. These calculations are the basis upon which Methodology 2 recommends feedback variables.;Analytical, simulation and experimental results are presented. The methodologies have been applied to three classes of linear processes using simulated experiments. Both methodologies performed much better than random selection of feedback variables and Methodology 2's performance is near optimal. The advantage of Methodology 1 is that it is much more easily implemented. The methodologies also have been applied to the process of etching a self-aligned gate in a reaction ion etcher. These experiments and the corresponding analysis are presented.
机译:在许多半导体制造过程中,重要的产品特性无法实时测量,因此无法使用实时反馈控制(RFC)直接控制。但是,RFC的好处包括通过干扰抑制减少变化,可以通过反馈与产品特性密切相关的过程变量来获得。减少产品特性的变化将提高工艺质量,提高产量并促进更具侵略性的产品设计。通常,用于反馈的过程变量的选择是基于有关过程的定性知识,在许多情况下这是有限的。;已开发出一对方法来选择最佳的过程变量以进行反馈,以最大程度地减少产品中的变化特征。这些方法利用设计实验数据的统计分析。影响产品变量变化的三个因素:潜在反馈变量与产品特性之间关系的强度,过程输入调整对产品变量的影响以及传感器噪声。第一种方法论(方法论1)量化了第一个因子,作为反馈变量选择的基础。第二种方法,方法2,量化了所有三个因素,作为选择反馈变量的基础。在方法1中,执行了一组设计的实验,同时记录了尽可能多的过程变量。在这些实验中将干扰变量作为因素包括在内。收集数据后,将比较过程变量的不同组合预测产品特性的能力。称为子集选择的回归分析子类别适用于此任务。为此,发现了一种新的子集选择方法,称为“约束限制穷举搜索”,它的性能优于其他技术,包括主成分回归和偏最小二乘回归。子集选择的结果用作方法1推荐反馈变量的基础。方法2使用方法1生成过程模型。该模型用于估计每种可能的反馈变量组合的产品特性变化。在这些计算中表示了导致变化的所有三个因素。这些计算是方法2推荐反馈变量的基础。给出了分析,仿真和实验结果。该方法已使用模拟实验应用于三类线性过程。两种方法的性能都比随机选择反馈变量好得多,方法2的性能接近最佳。方法1的优点是它更容易实现。该方法还已经应用于在反应离子蚀刻器中蚀刻自对准栅极的工艺。介绍了这些实验和相应的分析。

著录项

  • 作者

    Patterson, Oliver Desmond.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Electrical engineering.;Systems science.;Materials science.
  • 学位 Ph.D.
  • 年度 1998
  • 页码 157 p.
  • 总页数 157
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:48:39

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