首页> 外国专利> Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same

Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same

机译:用于测量多层重叠对准精度的重叠游标图案及其测量方法

摘要

An overlay vernier pattern for measuring multi-layer overlay alignment accuracy and a method for measuring the same is provided. A distance between a first alignment mark in a first material layer and a second alignment mark in an underlying second material layer is measured, so as to provide an alignment offset between the first material layer and the second material layer. In addition, a distance between the second alignment mark in the second material layer and a third alignment mark in a third material layer underlying the second material layer is measured, so as to provide an alignment offset between the second material layer and the third material layer. Because the second alignment marks can be repeatedly used, scribe line areas for forming these alignment marks and measuring time are saved to increase the production throughput.
机译:提供了一种用于测量多层覆盖物对准精度的覆盖物游标图案及其测量方法。测量第一材料层中的第一对准标记与下面的第二材料层中的第二对准标记之间的距离,以提供第一材料层和第二材料层之间的对准偏移。另外,测量第二材料层中的第二对准标记与第二材料层下面的第三材料层中的第三对准标记之间的距离,以提供第二材料层与第三材料层之间的对准偏移。 。由于可以重复使用第二对准标记,因此节省了用于形成这些对准标记的划线区域和测量时间,从而提高了生产量。

著录项

  • 公开/公告号US7190823B2

    专利类型

  • 公开/公告日2007-03-13

    原文格式PDF

  • 申请/专利权人 TZU-CHING CHEN;

    申请/专利号US20020063077

  • 发明设计人 TZU-CHING CHEN;

    申请日2002-03-17

  • 分类号G06K9/00;

  • 国家 US

  • 入库时间 2022-08-21 21:01:34

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