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System configured for applying a modifying agent to a non-equidimensional substrate

机译:配置用于将改性剂施加到非等距基底上的系统

摘要

The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
机译:本发明涉及用改性剂改性各种非等维底物的系统和方法。该系统包括处理室,该处理室被配置为使非等距基板穿过其中,其中,该处理室还被配置为在非等距基板移动通过处理室期间将处理混合物接收到处理室中。处理混合物可以在载体介质中包含改性剂,其中载体介质选自超临界流体,近临界流体,过热流体,过热液体和液化气。因此,在处理混合物和非等距基底之间接触时,可以将改性剂施加到非等距基底上。

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