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Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
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机译:晶圆背面涂层可平衡来自晶圆正面钝化层的应力,并用作芯片粘接剂
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摘要
A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the stress-causing layer before the die or wafer is significantly warped are provided. The SBL may also serve as, or support, an adhesive layer for die attach, and be of a markable material for an enhance marking method.
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