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Moveable contact assembly, method of manufacturing the same, and switch using the same

机译:活动触头组件,其制造方法以及使用该触头组件的开关

摘要

A movable contact assembly includes a base sheet made of insulating film, a contact provided under a bottom surface of the base sheet, and a conductive layer comprising silver paste on the base sheet. The silver paste contains 12 wt % to 15 wt % of resin binder and 35 wt % to 88 wt % of silver particles. The resin binder includes polyester resin having a glass-transition point ranging from 30° C. to 40° C. and an average molecular weight ranging from 30000 to 35000. The silver particles contain 70 wt % to 80 wt % of flake-shaped silver particles and 20 wt % to 30 wt % of dendritic silver particles. This conductive layer of the movable contact assembly can be baked at a low temperature, and does not have cracks and is not peeled off even when being bent. In addition, this conductive layer can easily cope with static electricity and has high reliability.
机译:可动触点组件包括:由绝缘膜制成的基片;设置在基片的底表面下方的触点;以及在基片上的包括银浆的导电层。银浆包含12重量%至15重量%的树脂粘合剂和35重量%至88重量%的银颗粒。树脂粘合剂包括玻璃化转变点为30℃至40℃且平均分子量为30000至35000的聚酯树脂。银颗粒包含70wt%至80wt%的片状银。颗粒和20重量%至30重量%的树枝状银颗粒。可动触点组件的该导电层可以在低温下烘烤,并且即使弯曲也没有裂纹并且也不会剥离。另外,该导电层可以容易地应对静电并且具有高可靠性。

著录项

  • 公开/公告号US7161103B1

    专利类型

  • 公开/公告日2007-01-09

    原文格式PDF

  • 申请/专利权人 MINORU KARAKI;MAKOTO SADAKANE;

    申请/专利号US20060447135

  • 发明设计人 MINORU KARAKI;MAKOTO SADAKANE;

    申请日2006-06-06

  • 分类号H01H1/02;

  • 国家 US

  • 入库时间 2022-08-21 20:59:49

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