The method manufactures sputter target assemblies (30). It first includes the step of manufacturing a target insert (10). The target insert (10) has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface (12). Then a backing plate (20) is manufactured. The backing plate (20) has a cylindrical recess (22) that corresponds to the diameter of the target insert (10). The cylindrical recess (22) has a depth less than the height of the target insert (10) and a yield strength less than the yield strength of the target insert (10). Finally, pressing the target insert (10) into the cylindrical recess (22) to the backing plate (20) bonds the target insert (10) of the backing plate (20) to form a target assembly (30). The pressed target assembly (30) contains the target insert (10) with the conical-shaped rear surface (12).
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