A NOVEL METALLIC PASTE COMPOSITION USEFUL AS AN INTERLAYER IN DIFFUSION SOLDERING.

摘要

This invention relates to a novel metallic paste composition useful as an interlayer in diffusion soldering. The novel metallic paste composition consists of a first metallic element which is in liquid state at room temperature, a second metallic element in powder form which can form an intermetallic compound with atleast one of the metals to be joined and a third metallic element in powder form which can form an intermetallic compound with the metal with which the second metallic element powder does not form an intermetallic compound. This enables fabrication of metal joints for a wide spectrum of metals.